From Microstructure to the Performance: A Computational Framework to Study the Response of Materials
Speaker: Vahid Attari
Location: Emerging Technologies Building (ETB) 3027
Time: Thursday, October 26, 2017 12:15 PM – 1:30 PM (CDT)
Abstract: The micropackaging technology in 3-Dimensional Integrated Circuits (3DIC) utilizes a three-level combined microbump and interconnection joint architecture. These micropackages are formed of thousands of interconnections, and hence confront significant design and materials related reliability concerns during service performance of these systems.
This seminar presents an integrated computational framework, incorporated by means of multiphase field approach together with electromigration model, vacancy evolution model, density functional theory, and dilute solution thermodynamic formalism to study the microstructure changes in Cu/Sn/Cu sandwich interconnection systems.
In the first stage, nucleation and growth of intermetallics during formation of the joint are investigated using the multi-phase field method. In the second stage, the performance of the joint under direct current fields for two of the obtained microstructural states are evaluated. It is shown that the intermetallic layer in the anode side grows faster while the intermetallic layer in the cathode side shrinks by increasing the current density. In the third stage, the equilibrium intrinsic point defect concentrations, solute site preferences in the crystal structure of the intermetallics, and the transient evolution of the point defects are investigated.
Brief Bio: Vahid Attari is a PhD candidate at the Department of Materials Science and Engineering, working for the computational materials science laboratory, under supervision of Dr. Raymundo Arroyave. He received his B.Sc. and M.Sc. degrees in Mechanical Engineering from Iran and Turkey, respectively. He first joined the research cohort at the Texas A&M University as a visiting research scholar during his master studies. His research is focused on phase field modeling, moving boundary problems, phase transformation, thermal, and electrical modeling of microstructural phenomena in materials. His research interests span mesoscopic study and modeling of behavior of the materials during transient phenomena. He has published one journal paper, one patent and presented his researches in International conferences such as ESOMAT, TMS and MS&T.